Innovative Applications of HarmonicDrive Actuators in Semiconductor Equipment

As semiconductor process technology evolves towards sub-5nm, equipment places higher demands on the accuracy, reliability, and space utilization of motion control systems. HarmonicDrive, with its integrated harmonic reduction technology and servo motor design, has become a core drive solution for key processes such as CMP (Chemical Mechanical Polishing), wafer transport, and photolithography equipment.

Product Technical Advantages

Ultra-High-Precision Positioning

The SHA series (such as the SHA65A) achieves a unidirectional positioning accuracy of ≤30 arc seconds (0.008°) with a reduction ratio of 1:161, meeting the submicron positioning requirements of wafer turntables.

The FHA-C series, equipped with a 1.6 million pulse/rev encoder, achieves positioning accuracy of up to 40 arc seconds (0.00025°/pulse), making it suitable for precision drive of mask stages in photolithography equipment.

Compact Design

The hollow structure (maximum φ65mm) allows for integration of air pipes and cables. The SHA series' flat body (maximum 222mm) lowers the center of gravity and saves 30% installation space. Ultra-mini models (32mm diameter) like the RSF-32A are directly embedded within the grinding head, achieving zero backlash during the grinding process.

High Dynamic Performance

The HMA direct-drive motor reaches speeds of 6000 rpm, and its hollow output structure is suitable for wafer drying applications, with torque fluctuations of <3%.

The FHA-40C outputs 690 Nm of torque in the lift-and-flip mechanism, increasing power density by 50% compared to traditional solutions.

Typical Applications

CMP Equipment

Turntable Drive: The SHA65A is compatible with high-inertia loads up to 220 kg, and a 1:161 reduction ratio enables rapid start and stop (acceleration > 0.5 rad/s²).

Grinding Head Control: The RSF series utilizes a 1:50 reduction ratio to stabilize grinding pressure, achieving wafer surface roughness Ra < 0.5 nm.

Wafer Transport System

The FHA-C mini series' ultra-thin design (only one-third the thickness of traditional models) is used in robotic arm joints, achieving repeatability of ±0.02 mm. Lithography Machines

The SHA-CG series optimizes output shaft end-face runout accuracy (<0.01mm) and is suitable for nanometer-level stepping control of mask stages.

Technology Evolution Trends

Intelligent Integration: Multi-axis synchronization is achieved through the EtherCAT bus (such as the Copley XEL-230-18 drive), shortening the control cycle to 125μs.

Material Innovation: The CSF reducer utilizes high-rigidity alloy steel, with a lifespan exceeding 20,000 hours, meeting the MTBF (mean time between failure) requirements of semiconductor equipment.

Energy Saving: DC24V low-power models (such as the FHA-C mini) meet cleanroom energy standards and reduce power consumption by 40%.

Conclusion

Harmonic actuators, driven by the dual-wheel combination of "precision transmission + intelligent control," continue to push the boundaries of semiconductor equipment performance. With the development of new technologies such as 3D packaging and heterogeneous integration, innovations in hollow structures and thermal stability will further drive industry upgrades.